Experienced all eight major semiconductor processes firsthand, deepening technical knowledge of each step
Completed theoretical and practical training in front-end semiconductor manufacturing processes
Performed dishwashing, food prep, sales, and customer service at a busy rest area restaurant
Performed dishwashing, food prep, sales, and customer service at a busy rest area restaurant
Friendly, positive attitude
Cumulative GPA: 4.15 / 4.50 (Major GPA: 4.08 / 4.50)
Awarded Second Prize at the 2024 Capstone Design Competition in Electronic Engineering
OPIc IH Test ID : 2I1588209532
Snowboarding
Cover Letter
OPIc IH Test ID : 2I1588209532