Summary
Overview
Work History
Education
Skills
Certification
Timeline
Generic

Jungyong Shin

Package Process Engineer
Seoul,11

Summary

Experienced package process with over 9+ years of experience in semiconductor. Excellent reputation for resolving problems and improving process and equipment.

Overview

9
9
years of professional experience
6
6
years of post-secondary education
1
1
Certification

Work History

Flip Chip Process and Equipment Part Leader

SK Hynix
03.2021 - Current
  • Managed part of employees, quality and equipment efficiency improvement.
  • Led the x-ray inspection deep learning project
  • Improved machine for quality assurance.

Flip Chip Process Engineer

SK Hynix
02.2017 - 02.2021
  • Built inspection system for flip chip soldering and improved inspection yield.
  • Set up flip chip process in China site.
  • Drove continuous improvement quality and productivity in mass produced products.

Package Product and Attach Development Engineer

SK Hynix
01.2016 - 01.2017
  • Developed penetration die attach film and package structure.
  • Developed thin and small die pick solution.

Die Attach Process Engineer

SK Hynix
01.2013 - 12.2015
  • Improved thin die adhesion and void control solution.
  • Drove continuous improvement quality and productivity in mass produced products.

Education

Bachelor's Degree - Materials Science And Engineering

Hanyang University
Seoul
03.2007 - 02.2013

Skills

    Risk management processes and analysis

Leadership and team building

Data analysis

Machine learning

Certification

POSTECH Specialist Program on the topic of Machine Learning, Pohang University of Science and Technology

Timeline

Flip Chip Process and Equipment Part Leader

SK Hynix
03.2021 - Current

POSTECH Specialist Program on the topic of Machine Learning, Pohang University of Science and Technology

09-2020

Flip Chip Process Engineer

SK Hynix
02.2017 - 02.2021

Package Product and Attach Development Engineer

SK Hynix
01.2016 - 01.2017

Die Attach Process Engineer

SK Hynix
01.2013 - 12.2015

Bachelor's Degree - Materials Science And Engineering

Hanyang University
03.2007 - 02.2013
Jungyong ShinPackage Process Engineer