Cleanroom Fabrication Practicum
07.2025 - 07.2025
- Fabricated Metal–Oxide–Semiconductor Capacitors (MOSCAPs) using a lift-off etching process in a Class 100 cleanroom environment.
- Processed pre-oxidized silicon wafers through photolithography (spin coating, baking, exposure, development) and metal deposition via DC sputtering.
- Conducted photoresist stripping and measured thin-film thickness with an ellipsometer, followed by C–V characterization and error analysis comparing measured and theoretical capacitance values.
- Learned vacuum system operation by observing and controlling pressure gauges, mechanical and turbo pumps used in sputtering and CVD equipment.
- Gained practical understanding of gas delivery and piping systems, including valve configuration, flow control, and safety interlocks within the cleanroom facility.
- Developed awareness of contamination control, leak prevention, and vacuum integrity crucial for semiconductor fabrication processes.