SANGIN LEE
Semiconductor Engineer
Suwon,45
Summary
Experienced ASIC(Testchip) deign almost 2 years and SoC(AP) implementation almost 2 years. Developed various abilities for "chip design" or "chip implementation" during making Testchips for SAMSUNG. And then I wanted to experience big project, moved to HARMAN to make commercial SoC with SAMSUNG. Now I would like to experience making various commercial chips for various customers.
Overview
5
5
years of professional experience
2
2
Languages
Work History
PI(Physcial Implementation)
Harman
05.2022 - Current
SoC(AP) Physical Implementation.
Researcher
Eyesbee
09.2019 - 05.2022
ASIC(Testchip) design & verification. Increased productability to 60%.
Education
Bachelor of Engineering in Electronics Engineering - Electronic Engineering, South Korea
Chungnam National University
Deajeon, South Korea 04.2001 -
Skills
RTL design
Memroy MBIST implementation
Synthesis & SDC production
Functional simulation
Design sanity check(EQ/LDRC/VSLP)
STA(Static Timing Analysis) & ECO
Physical verification(IR-drop/sigem/dvd)
Testvector production
Automation ASIC flow with script production(csh/tcl/awk/python)
Design environment set-up & analysis
Good communication skill
Timeline
PI(Physcial Implementation)
Harman
05.2022 - Current
Researcher
Eyesbee
09.2019 - 05.2022
Bachelor of Engineering in Electronics Engineering - Electronic Engineering, South Korea
Chungnam National University
04.2001 -