Summary
Overview
Work History
Education
Skills
Accomplishments
Interests
Timeline
Generic

Seok-Geun(SG) Ahn

IC Packaging Engineer
Hwaseong-si,41

Summary

Accomplished Senior Engineer with a proven track record at Samsung Electronics, demonstrating exceptional team leadership and cross-functional collaboration. Expert in packaging engineering, I've led initiatives that significantly enhanced productivity and fostered innovation. Skilled in technical presentation and mentoring, I excel in driving projects to successful completion, ensuring quality and efficiency. Analytical [Job Title] focused on applying sound engineering principles using both traditional and innovative methods. Award-winning [Type] Engineer focused on sustainable design. Highly effective at working with teams of designers and builders to accomplish projects on-time and according to cost constraints. Organized and dependable candidate successful at managing multiple priorities with a positive attitude. Willingness to take on added responsibilities to meet team goals. To seek and maintain full-time position that offers professional challenges utilizing interpersonal skills, excellent time management and problem-solving skills. Hardworking and passionate job seeker with strong organizational skills eager to secure entry-level [Job Title] position. Ready to help team achieve company goals. Detail-oriented team player with strong organizational skills. Ability to handle multiple projects simultaneously with a high degree of accuracy.

Overview

13
13
years of professional experience

Work History

Senior Engineer

Samsung Electronics
11.2017 - Current
  • Presented technical findings at conferences as an active member within the professional community, establishing credibility as a thought leader in the field of packaging engineering.
  • Coordinated with marketing teams to develop promotional packages that effectively communicated brand messaging to consumers.
  • Mentored junior engineers in best practices for design and problem-solving techniques, fostering a culture of continuous improvement.
  • Identified root causes of recurring issues in manufacturing processes through thorough investigation, leading to increased productivity.
  • Collaborated with cross-functional teams to ensure seamless integration of new packaging concepts into manufacturing processes.
  • Managed vendor relationships for timely delivery of quality materials, meeting project deadlines and budget requirements.

IC Packaging Engineer

Amkor Technology Inc
03.2011 - 10.2017
  • Improved team productivity by providing technical guidance and mentoring junior engineers.
  • Established strong working relationships with clients through exceptional communication skills, fostering trust and collaboration.
  • Achieved successful project outcomes by maintaining accurate documentation and meeting strict deadlines.
  • Developed positive working relationships with stakeholders to effectively coordinate work activities.

Education

M.D. - Material Science And Engineering

Hongik University
Seoul, South Korea
04.2001 -

Bachelor of Science - Material Science And Engineering

Hongik University
Seoul, South Korea
04.2001 -

Skills

Team Leadership

Management skills

Leadership skills

Quality Control

Process Development

Technical reporting

Technical presentation

Cross-Functional Collaboration

Material Selection

Packaging validation

Manufacturing process understanding

Mockups and prototypes

Time Management

Self Motivation

Accomplishments

  • Achieved [Result] by introducing [Software] for [Type] tasks.
  • Used Microsoft Excel to develop inventory tracking spreadsheets.
  • Supervised team of [Number] staff members.

Interests

Classical Rock

Photograph

Bicycle

Timeline

Senior Engineer

Samsung Electronics
11.2017 - Current

IC Packaging Engineer

Amkor Technology Inc
03.2011 - 10.2017

M.D. - Material Science And Engineering

Hongik University
04.2001 -

Bachelor of Science - Material Science And Engineering

Hongik University
04.2001 -
Seok-Geun(SG) AhnIC Packaging Engineer