Summary
Overview
Work History
Education
Skills
Career Experience
Submit Date
Applicant
Personal Information
Military Service
Timeline
Generic
TAI SIK YANG

TAI SIK YANG

Global Product Support Engineer
Hwaseong-si

Summary

Knowledgeable Global Product Support Engineer with strong background in engineering principles and project management. Successfully led multiple initiatives to improve process efficiency and product quality. Demonstrated expertise in problem-solving and collaboration with cross-functional teams.

Overview

19
19
years of professional experience
7
7
years of post-secondary education

Work History

AMK Photolithography GPS Engineer

Applied Materials Korea
Hwaseong-si, Gyeonggi-do
07.2022 - Current
  • SEC Hwaseong NRD Fab – Photomask product install and Global support
  • SEC Giheung SR1 Fab - Photomask product install and Global support
  • SEC Pyeongtaek P4 Fab - Photomask product install and Global support
  • Micron Boise Fab - Photomask product install and Global support
  • MTC 1 Fab : Annual PM Support – July. 2022
  • MTC 1 Fab : Troubleshooting support – Mar. 2024 to April. 2024
  • MTC 2 Fab New product install support – Mar. 2024 to April. 2024
  • Established strong working relationships with clients through exceptional communication skills, fostering trust and collaboration.
  • Wrote, reviewed and edited technical document in accordance with template requirements.
  • Optimized engineering processes by implementing innovative solutions and streamlining workflow.
  • Enhanced product performance by conducting thorough failure analysis and recommending improvements.
  • Reviewed technical drawings developed by CAD technicians and drafters.
  • Documented and developed engineering procedures and processes.
  • Collaborated with other departments to facilitate successful project completion.

AMK FSO Display Lead CE

Applied Materials Korea
Cheonan, Chungcheongnam-do
05.2016 - 06.2022
  • SDC A3 25KPXi CVD System Ph2 ~ Ph9 set-up and warranty Owner
  • SDC A3 25KPXi CVD System Octa conversion & Octa to BP Conversion support
  • SDC A3 Particle Reduction Project progress
  • Unusual particle map issue follow-up & Reporting
  • Business Owner in charge of MIL (Maintenance Improvement Lid)
  • SDC A3 all Fab and A4 all Fab support
  • To reduce the particles, we disassemble all LIDs, clean all parts, reassemble them, and deliver them to SDC customers
  • SDC QDOLED PJT Relocation system Un-installation Sub Lead CE
  • SDC QDOLED PJT Relocation system Installation Sub Lead CE & System Owner
  • SDC QDOLED PJT TFT Product Lead CE & Team management
  • SDC A3 New PJT TFT Product Lead CE & Team management
  • Worked well in a team setting, providing support and guidance.
  • Managed time efficiently in order to complete all tasks within deadlines.
  • Worked flexible hours across night, weekend, and holiday shifts.
  • Resolved problems, improved operations and provided exceptional service.
  • Participated in team projects, demonstrating an ability to work collaboratively and effectively.

Grinder Process Engineer (Package Process)

Disco Hi-tec Korea
Bundang, 41
01.2015 - 08.2015
  • Semiconductor Wafer Grinder system installer and Grinder Process Recipe set-up
  • Samsung Electron K-Line Package (TSV Process) equipment Set-up
  • SK Hynix Package (Dicing process) equipment Set-up
  • Find issues that occur during the assembly process and issue reporting and troubleshooting to the headquarters design team or process group.
  • Set up and ran equipment to complete grinding tasks efficiently and within required timeframes.
  • Ensured consistent results across multiple production runs by adhering closely to established processes while monitoring machine conditions.
  • Displayed strong problem-solving abilities when faced with challenging projects or unexpected obstacles during the grinding process.
  • Conducted root cause analysis to identify, prioritize and eliminate process losses.
  • Developed process control strategies for optimizing equipment performance and reducing variability in production output.

Manufacturing Engineer

ULVAC Korea
Pyeongtaek-si, Gyeonggi-do
04.2006 - 12.2014
  • Sputter (PVD) System Equipment Manufacturing & Customer Service
  • SDC T7-1 / T7-2 PVD In-line type system Set-up
  • SDC T8-1 / T8-2 PVD In-line type system Set-up
  • SDC A2 Ph1 PVD Cluster type system Set-up
  • SDC A1 PVD Cluster type system Set-up
  • SDC L5, L6 CVD Set-up
  • CMD (CVD) System Equipment Manufacturing & Customer Service
  • SDC L5, L6 CVD Cluster type system Set-up
  • SDC A2 Ph1 CVD Cluster type system Set-up
  • LGD Gumi 5Line CVD Cluster type system Set-up
  • Problems in parts defects occurring during the assembly of PVD or CVD equipment. Focus on identifying and reporting resolve
  • Reviewed products for compliance with Design for Manufacturing (DFM) requirements.
  • Conducted root cause analysis on defective products, leading to targeted improvements in manufacturing processes.
  • Coordinated selection of manufacturing methods, fabrication, and operation of product designs.

Education

Master of Science - Materials Science Engineering

Korea University Graduate School
Seoul
03.2019 - 02.2022

Bachelor of Science - Electronic engineering

Han-kyong National University
Anseong, 41
03.2010 - 02.2012

Associate of Science - Materials science engineering

Seong Nam Polytech College
Seongnam
03.2001 - 02.2003

Skills

Toeic Speaking Lv5

Japanese: More than Intermediate

MS Office OA skills

SAP Tools Handling skills

Engineering drawing skills

Technical reporting

Root-cause analysis

System troubleshooting

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Career Experience

  • Manufacturing Engineer, 04/01/06, 12/31/14, Sputter (PVD) System Equipment Manufacturing & Customer Service, SDC T7-1 / T7-2 PVD In-line type system Set-up, SDC T8-1 / T8-2 PVD In-line type system Set-up, SDC A2 Ph1 PVD Cluster type system Set-up, SDC A1 PVD Cluster type system Set-up, SDC L5, L6 CVD Set-up, CMD (CVD) System Equipment Manufacturing & Customer Service, SDC L5, L6 CVD Cluster type system Set-up, SDC A2 Ph1 CVD Cluster type system Set-up, LGD Gumi 5Line CVD Cluster type system Set-up, Problems in parts defects occurring during the assembly of PVD or CVD equipment. Focus on identifying and reporting resolve
  • Grinder Process Engineer (Package process), 01/01/15, 08/31/15, Semiconductor Wafer Grinder system installer and Grinder Process Recipe set-up, Samsung Electron K-Line Package (TSV Process) equipment Set-up, SK Hynix Package (Dicing process) equipment Set-up, Find issues that occur during the assembly process and issue reporting and troubleshooting to the headquarters design team or process group.
  • AMK FSO Display Lead CE, 05/01/16, 06/30/22, SDC A3 25KPXi CVD System Ph2 ~ Ph9 set-up and warranty Owner, SDC A3 25KPXi CVD System Octa conversion & Octa to BP Conversion support, SDC A3 Particle Reduction Project progress, Unusual particle map issue follow-up & Reporting, Business Owner in charge of MIL (Maintenance Improvement Lid), SDC A3 all Fab and A4 all Fab support, To reduce the particles, we disassemble all LIDs, clean all parts, reassemble them, and deliver them to SDC customers, SDC QDOLED PJT Relocation system Un-installation Sub Lead CE, SDC QDOLED PJT Relocation system Installation Sub Lead CE & System Owner, SDC QDOLED PJT TFT Product Lead CE & Team management, SDC A3 New PJT TFT Product Lead CE & Team management
  • AMK Photolithography GPS engineer, 07/01/22, Present, SEC Hwaseong NRD Fab – Photomask product install and Global support, SEC Giheung SR1 Fab - Photomask product install and Global support, SEC Pyeongtaek P4 Fab - Photomask product install and Global support, Micron Boise Fab - Photomask product install and Global support, MTC 1 Fab : Annual PM Support – 07/01/22, MTC 1 Fab : Troubleshooting support – 03/01/24 to 04/30/24, MTC 2 Fab New product install support – 03/01/24 to 04/30/24

Submit Date

06/27/25

Applicant

TAI SIK YANG

Personal Information

Date of Birth: 08/01/82

Military Service

10/01/03, 10/01/05, Completed military service - Helicopter Preventive maintenance and Corrective Maintenance

Timeline

AMK Photolithography GPS Engineer

Applied Materials Korea
07.2022 - Current

Master of Science - Materials Science Engineering

Korea University Graduate School
03.2019 - 02.2022

AMK FSO Display Lead CE

Applied Materials Korea
05.2016 - 06.2022

Grinder Process Engineer (Package Process)

Disco Hi-tec Korea
01.2015 - 08.2015

Bachelor of Science - Electronic engineering

Han-kyong National University
03.2010 - 02.2012

Manufacturing Engineer

ULVAC Korea
04.2006 - 12.2014

Associate of Science - Materials science engineering

Seong Nam Polytech College
03.2001 - 02.2003
TAI SIK YANGGlobal Product Support Engineer