JoonHo Bang
Process Engineer
Seongnam-si
Overview
3
3
years of professional experience
1
1
Certification
Work History
High-throughput Experiment Driven Development of Next Generation Semiconductor Interconnects
Sungkyunkwan University & Samsung Electronics
02.2023 - Current
- Collaborated with the Samsung R&D team to develop Cu-based next-generation interconnect alloys, including Co and Ru alloys.
- Conducted high-throughput experiments to deposit thin film alloys on silicon wafers using sputtering (PVD), and used XRD, TEM, and a 4-point probe for evaluating properties such as resistivity and electromigration resistance.
- Investigated the alloying effects on grain boundary diffusion and enhanced electromigration resistance, contributing to the identification of alloys with lower resistance for advanced semiconductor devices.
- Discovered specific Co-based alloy compositions that simultaneously achieved lower electrical resistivity and superior electromigration resistance compared to pure Cu and Co.
Machine Learning Analysis of High-k Metal Gate Semiconductor Process
Sungkyunkwan University & Samsung Electronics
02.2023 - Current
- Published a first-author research paper on optimization of high-k metal gate peripheral transistor processes. (doi.org/10.1063/5.0191100)
- Engineered advanced HfSiON-based high-k/metal gate stacks with optimized interlayer nitridation and metal work-function tuning to enhance DRAM transistor performance.
- Conducted material-level optimization of high-k/metal gate stacks, including interlayer nitridation and HfSiON integration, achieving improved reliability and reduced leakage in DRAM devices.
- Developed and optimized deposition/nitridation processes for high-k/metal gate stacks (HfSiON, TiN/Al) to address interface trap density and threshold voltage stability in advanced DRAM transistors.
- Implemented AI analysis techniques including anomaly detection, inverse design, and explainable AI (XAI) for device process optimization through MES.
Education
Master of Mechanical Engineering -
Sungkyunkwan University
02.2025
Bachelor of Material Science and Engineering - undefined
University of Seoul
02.2023
Skills
- PVD (Magnetron sputter), XRD, XPS, TEM (prepared thin film lamella samples using FIB for microstructural analysis) based thin film alloy characterization skills
- Semiconductor analysis equipment (4-point probe, thin film cleaving test) setup and operation skills
- Machine learning based semiconductor process analysis skills
- Language: English (Advanced), Korean (Native)
- Computer: Python (Pytorch, Tensorflow), Minitab, Matlab, LabView, Excel, MS Word, PowerPoint
Certification
OPIc English: Intermediate High (2C3038529497, 2024-08-21)
EXTRA-CURRICULAR ACTIVITIES
Member, Soccer Club Present Dongcheon-dong Early Morning Soccer Club | Nov 2019 – Present Actively playing as a midfielder in a local soccer club.
OTHERS
- Date of Birth: July 28th, 1996
- Address: 102-dong 808-ho, 12, Pangyo Daejang-ro 2-gil, Bundang-gu, Seongnam-si, Gyeonggi-do, Republic of Korea
- Military Service: Discharged from Korea Army (2017-10 - 2019-06)
https://www.dleelab.org/
Labatory
Timeline
High-throughput Experiment Driven Development of Next Generation Semiconductor Interconnects
Sungkyunkwan University & Samsung Electronics
02.2023 - Current
Machine Learning Analysis of High-k Metal Gate Semiconductor Process
Sungkyunkwan University & Samsung Electronics
02.2023 - Current
Bachelor of Material Science and Engineering - undefined
University of Seoul
Master of Mechanical Engineering -
Sungkyunkwan University
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