Experienced Camera EE Engineer with over 7 years at LG Innotek’s Optical Solutions Division, specializing in multilayer PCB design, actuator control, and sensor integration. Strong track record in resolving complex signal noise issues, optimizing firmware, and developing custom test equipment to ensure high-performance camera quality. Led both early development and mass production of advanced camera modules, working closely with clients on specification alignment and conducting root cause analysis (FACA) to address critical issues. Demonstrated ability to drive innovation through design reviews, solve challenging engineering problems, and deliver reliable, high-quality solutions through strong technical execution, clear communication, and a proactive mindset
Joined an early-stage PoC project with a major North American tech client(Company A) as a core engineer. Took ownership of all camera module PCB designs and implemented signal shielding solutions to eliminate interference between actuator control and image sensor signals. Introduced and verified a novel sub- micron level position sensor, achieving highly accurate actuator control. Leveraging past experience in OIS, now lead OIS control development, while also managing customer-facing technical discussions including spec alignment, metrology equipment development, and client lab tours.
Worked simultaneously on two projects.
In the first, supported mass production of the second-gen continuous zoom model, re-engineering the OIS suppression ratio test process due to removal of the gyro sensor. Developed an alternative test method in collaboration with the client, successfully validating its GRR for production use. Also contributed to firmware updates to address ball-type actuator issues caused by friction.
In the second, joined a fixed-zoom camera project for Google mid-way to solve OIS-related issues. Enhanced OIS noise performance and suppression ratio, and developed a new calibration method to correct optical axis shift during zoom scope variation-directly meeting client performance expectations.
Contributed to the second-generation continuous zoom mass production project from early development. Took part in image sensor selection through close coordination with the client and led PCB design for OIS and Zoom/AF modules. Applied lessons learned from the first-generation zoom to enhance firmware in collaboration with D-IC partners. Successfully improved OIS noise performance to enhance SFR and participated in re-designing actuator to mitigate AF-OIS crosstalk.
Took part in the worldʼs first mass production of a continuous zoom camera module for Japan client(Company S). Involved in early-stage development including sensor, OIS, and AF PCB design and control. Worked closely with D-IC vendors to develop calibration algorithms for ball-type actuators and continuous zoom control. Played a key role in aligning product specs and test methods with the customer, and later transitioned into leading the OIS function during production, performing in-depth failure analysis to improve product yield and ensure production readiness.
Joined in advanced development project for front camera utilizing liquid lens technology. Actively participated in sensor PCB design while primarily focusing on reducing image sensor noise caused by PWM-based liquid lens driving. Designed and implemented high-voltage output circuits from low-voltage mobile input, addressed sensor noise via shielding techniques, and developed compensation algorithms to stabilize lens performance against temperature variation.
Technical Skills
Tools & Methods
Soft Skills